I know IBM was working on a 3D die a while back but couldn't figure out a good way of dissipating the heat from the lower levels...I guess using these 'fins' instead of having multiple levels was how Intel got around that.
I know IBM was working on a 3D die a while back but couldn't figure out a good way of dissipating the heat from the lower levels...I guess using these 'fins' instead of having multiple levels was how Intel got around that.
Check the TOS for rules about links in signatures...
Been reading an article in Micro Mart mag about these chips and it's near impossible to put the size of the 22nm architecture into something meaningful but this might help, a single strand of human hair averages around 50,000, not a typo, fifty thousand nm in diameter and the smallest known viruses are 20nm across so Intel are working on the organic scale, I'm impressed!